Topic

CASPA CEO Summit Agenda

Friday, October 23 · Afternoon

Annual Conference, Day 1

1:30 – 1:40 PM

CASPA Opening

1:40 – 2:00 PM
KEYNOTEAI Compute

$100/Watt: The Evolving Economics of AI Infrastructure

What AI infrastructure really costs, counted in watts.

Bill Brennan
Bill BrennanCEO, Credo
2:00 – 2:40 PM
PANELCapital & Markets

Semiconductor Industry Outlook Panel

Where the analysts see demand and competition heading.

Stacy Rasgon
Stacy RasgonManaging Director, Bernstein
Dylan Patel
Dylan PatelCEO, SemiAnalysis
Moderated by
Austin Lyons
Austin LyonsIndependent Analyst, Chipstrat
2:40 – 3:30 PM
PANELCapital & Markets

Silicon Capital: Investing in the Next Semiconductor Wave

What investors are backing in the next wave of semiconductors.

Shahin Farshchi
Shahin FarshchiGeneral Partner, Lux Capital
Albert Kim
Albert KimHead, Samsung Ventures America
Andrew Tan
Andrew TanManaging Director, Salience Capital
Umesh Padval
Umesh PadvalManaging Partner, Seligman Ventures
Moderated by
Brandon Wang
Brandon WangVP, Synopsys
3:30 – 4:20 PM
PANELAI Compute

AI Computing: Designing the Next Generation of Intelligence

How the next generation of AI computing is being designed.

Faraj Aalaei
Faraj AalaeiCEO, Cognichip
Sunghyun Park
Sunghyun ParkCEO, Rebellions
Rajiv Khemani
Rajiv KhemaniExecutive Chairman, Upscale AI · CEO, Velaura AI
Moderated by
Daniel Nenni
Daniel NenniFounder, SemiWiki
4:20 – 5:10 PM
PANELAI Compute

Edge AI & Intelligent Infrastructure

How AI moves out of the data center and to the edge.

Krishna Rangasayee
Krishna RangasayeeCEO, Sima.ai
Melton Chang
Melton ChangPresident, Schneider Electric Power Systems
Sid Sheth
Sid ShethCEO, D-Matrix
Moderated by
Dylan Patel
Dylan PatelCEO, SemiAnalysis
5:10 PM

Conference Close

6:00 – 7:00 PM

BOD Election

Saturday, October 24 · Morning

Annual Conference, Day 2

9:00 – 9:10 AM

CASPA Welcome Remarks

9:10 – 9:30 AM
KEYNOTEIndustry & Leadership

SEMI Industry Update

The state of the industry, from the CEO of SEMI.

Ajit Manocha
Ajit ManochaCEO, SEMI
9:30 – 9:50 AM
KEYNOTEIndustry & Leadership

Advancing Humanity through Responsible Design

Why standards, trust and talent shape what technology becomes.

Mary Ellen Randall
Mary Ellen RandallPresident & CEO, IEEE
9:50 – 9:55 AM
KEYNOTEIndustry & Leadership

Collaboration, Innovation, and Leadership in the AI Era

How collaboration and leadership are changing in the AI era.

Jodi Shelton
Jodi SheltonCEO, Global Semiconductor Alliance
9:55 – 10:15 AM
KEYNOTEDesign & Security

Re-Engineering the Future

The CEO of Synopsys on re-engineering the future of design.

Sassine Ghazi
Sassine GhaziCEO, Synopsys
10:15 – 10:30 AM

Break

10:30 – 11:10 AM
PANELMemory & Storage

Data Storage & Infrastructure in the AI Era

How AI is reshaping data storage and infrastructure.

Avi Shetty
Avi ShettyVice President, Solidigm
Khurram Ismail
Khurram IsmailCPO, Sandisk
Hao Zhong
Hao ZhongCEO, ScaleFlux
Moderated by
Nan Zhou
Nan ZhouDirector, Temasek
11:10 – 11:50 AM
PANELAI Compute

AI Compute: Architectures Beyond the GPU

Which architectures are competing to go beyond the GPU.

Naveen Rao
Naveen RaoCEO, Unconventional AI
Faris Sbahi
Faris SbahiCEO, Normal Computing
Rodrigo Liang
Rodrigo LiangCEO, SambaNova
Moderated by
Max Cherney
Max CherneyTech Correspondent, Reuters
11:50 AM – 1:00 PM

Networking Lunch

Saturday, October 24 · Afternoon

Annual Conference, Day 2

1:00 – 1:20 PM
KEYNOTENetworking & Optics

The Race to Connect AI

How AI systems get connected as data centers scale.

Michael Hurlston
Michael HurlstonCEO, Lumentum
1:20 – 1:40 PM
KEYNOTEDesign & Security

ASIC Design and Cyber Security

Why custom silicon design and security now go together.

Michael Xie
Michael XiePresident & Co-founder, Fortinet
1:40 – 2:00 PM
KEYNOTEMemory & Storage

WD Address

The CEO of Western Digital on where data storage is going.

Irving Tan
Irving TanCEO, WD
2:00 – 2:30 PM
PANELIndustry & Leadership

The Next Semiconductor Era: FPGAs, Advanced Manufacturing & Physical AI

What FPGAs, advanced manufacturing and physical AI mean for what comes next.

Raghib Hussain
Raghib HussainCEO, Altera
David Lam
David LamCEO, Multibeam · Founder, Lam Research
Moderated by
Nitin Dahad
Nitin DahadExecutive Editor, EE Times
2:30 – 2:40 PM

Break

2:40 – 3:20 PM
PANELAI Compute

From AI Algorithms to AI Silicon: Redefining the Future of Compute

How algorithms are being turned into silicon.

Anna Goldie
Anna GoldieCEO, Ricursive Intelligence
Gavin Uberti
Gavin UbertiCEO, Etched
Ankur Gupta
Ankur GuptaHead of EDA IC, Siemens
Moderated by
Edward Sperling
Edward SperlingEditor in Chief, Semiconductor Engineering
3:20 – 4:00 PM
PANELNetworking & Optics

Optical Interconnects & High-Speed Connectivity: The Next Data Center

What optical interconnects mean for the next data center.

Albert Zhang
Albert ZhangCEO, Silith
Mark Wade
Mark WadeCEO, Ayar Labs
Hong Hou
Hong HouCEO, Semtech
Moderated by
Dan Armbrust
Dan ArmbrustCo-founder, Silicon Catalyst
4:00 – 4:30 PM
FIRESIDEAI Compute

Wafer-Scale AI: Breaking the Compute Bottleneck

A conversation on wafer-scale AI and the compute bottleneck.

Andrew Feldman
Andrew FeldmanCEO, Cerebras
Jimmy Cheng
Jimmy ChengPresident, CASPA '26–'27
4:30 – 5:00 PM

Dinner Banquet Registration

Saturday, October 24 · Evening

35th Anniversary Dinner Banquet

5:00 – 6:00 PM

VIP Reception

6:20 – 6:30 PM

Welcome Speech

6:30 – 6:35 PM
KEYNOTE

Welcome Remarks by San Jose Mayor Matt Mahan

Matt Mahan
Matt MahanMayor, City of San Jose
6:35 – 6:40 PM
CEREMONY

Bay Area Mayors on Stage

6:40 – 7:00 PM

Dinner

7:00 – 7:15 PM
KEYNOTE

CASPA 2025–2026 President Gary Wang’s Speech

Gary Wang
Gary WangPresident, CASPA '25–'26
7:15 – 7:25 PM
CEREMONY

CASPA Leadership Transition Ceremony

7:25 – 7:40 PM
KEYNOTE

CASPA 2026–2027 President Jimmy Cheng’s Speech

Jimmy Cheng
Jimmy ChengPresident, CASPA '26–'27
7:40 – 7:45 PM
KEYNOTE

Special Address and Introduction of Lip-Bu Tan

Chenming Hu
Chenming HuFather of the 3D Transistor, UC Berkeley
7:45 – 8:45 PM
FIRESIDEIndustry & Leadership

Fireside Chat: Intel CEO Lip-Bu Tan and CASPA President Jimmy Cheng

A conversation with the CEO of Intel.

Lip-Bu Tan
Lip-Bu TanCEO, Intel
Jimmy Cheng
Jimmy ChengPresident, CASPA '26–'27
8:45 – 9:05 PM
CEREMONY

Award Ceremony for Annual Conference Speakers on Stage

9:05 – 9:20 PM
CEREMONY

CASPA/IEEE Scholarship, issued by the IEEE President and the Intel CEO

Mary Ellen Randall
Mary Ellen RandallPresident & CEO, IEEE
Lip-Bu Tan
Lip-Bu TanCEO, Intel
9:20 – 9:35 PM

Raffle

9:35 – 10:05 PM

Networking

Plasma EtchVenture CapitalAdvanced PackagingSilicon PhotonicsData CenterEDAAI InfrastructureFoundrySupply ChainSerDesGPUPhysical AIStandardsOptical InterconnectChipletsAdvanced ManufacturingFPGALithographyProcess NodeM&AInferenceData StorageCo-Packaged OpticsCustom SiliconMarket OutlookWafersSwitchingASICPartnershipsWafer-ScaleIPOEdge AIEquipmentCo-DesignPolicyTalentReliabilityRoboticsSSDNANDFabCleanroomIPRTLTape-outVerificationLatencyTestPowerArchitectureBandwidthTrainingCybersecurityFinFET01 · Design02 · Fabricate03 · Package & Test04 · Connect & Store05 · Deploy06 · Capital & Market
Seats are limited

Be In The Room For All Of It.

Get Your Ticket →

Schedule and speakers are subject to change.

Seats are limited

Be In The Room For All Of It.

Get Your Ticket →

Schedule and speakers are subject to change.

01 · Design

EDAFPGACustom SiliconASICCo-DesignIPRTLTape-outVerificationArchitecture

02 · Fabricate

Plasma EtchFoundryAdvanced ManufacturingLithographyProcess NodeWafersEquipmentFabCleanroomFinFET

03 · Package & Test

Advanced PackagingChipletsCo-Packaged OpticsWafer-ScaleReliabilityTest

04 · Connect & Store

Silicon PhotonicsSerDesOptical InterconnectData StorageSwitchingSSDNANDLatencyBandwidth

05 · Deploy

Data CenterAI InfrastructureGPUPhysical AIInferenceEdge AIRoboticsPowerTrainingCybersecurity

06 · Capital & Market

Venture CapitalSupply ChainStandardsM&AMarket OutlookPartnershipsIPOPolicyTalent